X3 S

High Speed Inline
AXI system

Description

The MatriX X3-S is an automatic X-ray inspection system featuring combined Transmission and 3D-Technology for sophisticated high-speed inspection in electronic production. The system is based on the MatriX X2.5 AXI system platform but is equipped with an additional detector axis used to generate the angle-shot images for the 3D reconstruction. This newly developed 3D reconstruction software generates high resolution slice images for 3D analysis of solder joints. Main applications are double-sided boards with critical overlapping areas.

​X-ray System Features

  • High Speed Inline AXI system
  • Maintenance free sealed X-ray tube and digital detector technology
  • 5 axes programmable motion
  • Component in-tray handling setup (with automatic top clamp for parts)
  • Inline pass-trough or dual lane in/out setup
  • Automatic grey-level and geometrical calibration
  • Full product traceability via customized MES-Interface
  • Mixed inspection mode (transmission and dynamic 3D sart)

Inspection speed

Transmission (2D)
Off-axis (2.5D)
3D SART
4-5 images/sec
3-4 images/sec
1 s /FOV (dynamic 3D mode)

Microfocus X-ray source (sealed)

standard:
130kV/40W
optional:
120kV/40W

​Detector

standard:
CMOS Flatpanel Detector
(14 bit, 1k x 1k, 75 µm)
optional:
CMOS Flatpanel Detector
(14 bit, 1,5k x 1,5k, 75 µm)
CMOS Flatpanel Detector
(14 bit, 2,3k x 2,3k, 50 µm)

Applications

Inspection Technologies

Resources

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